Bill of materials
20230420 RR

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Part Value     Device     Package    Description
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C2   100nF     C0805      RC0805     Kondensator 0805
C3   100nF     C0805      RC0805     Kondensator 0805
C10  10uF      C1206      RC1206     Kondensator 1206
C11  10uF      C1206      RC1206     Kondensator 1206
IC1  Mainboard ST-DMATHT2 DIL40-SPEZ ST-DMA im 40-poligen Gehäuse
IC2  74HC05    74X05SMD   SO14       Open Collector, invertierend 6mal
IC3  74F74     74X74SMD   SO14       D-Flip-Flop mit pos. Eingang 2mal,
                                     Preset und Clear
R1   1K        R0805      RC0805     Widerstand 0805

Please note!
All components are assembled on the bottom side of the board.

Tip: Equip IC2 and IC3 first, then the capacitors and the resistor. Finally,
     the individual solder cups (Lötkelche) follow, which are pressed into
     the PCB from above and soldered from below. The solder cups can be snap-
     ped out of an IC socket.